Typical applications:
Semiconductor inspection – Backside wafer inspection, TSV (through-silicon via) measurement, defect review after laser dicing
Failure analysis – Non-destructive imaging through silicon substrates to inspect buried structures
Laser processing – Real-time observation of 1064 nm fiber laser ablation, drilling, or welding in materials science and manufacturing
Metallurgy & materials science – High-resolution inspection of laser heat-affected zones, recast layers, and microstructures
NIR fluorescence microscopy – For biological or materials samples requiring near-infrared excitation