Product Recommendation | Large-Field Industrial Microscope Objectives

Objective Introduction

Wavelength Opto-Electronic’s large-field industrial microscope objectives are manufactured with high-quality optical glass and anti-reflection coatings, significantly improving light throughput. The plan apochromatic design delivers crisp imaging details and high contrast. Built on an infinity-corrected optical system with a parfocal distance of 95 mm, these objectives are designed for brightfield coaxial illumination. They enable large-field observation, supporting an image circle diameter up to 40 mm, facilitating integration with various accessories and adaptation to complex working conditions. They are widely used in precision metrology and inspection in the semiconductor industry, as well as high-precision visual analysis and quality monitoring across diverse industrial applications.

Product Portfolio

Brightfield Microscope Objectives

Designed specifically for coaxial brightfield imaging, these objectives feature a plan apochromatic optical configuration, delivering high imaging contrast and large-field observation capability, with a maximum image circle diameter of 40 mm.

NUV Plan Apo 20X

NUV Plan Apo 20X

Specification Parameter Specification Parameter
Magnification (X) 20X Numerical Aperture (NA) 0.45
Working Distance (WD) 20mm Focal Length 10mm
Resolution 0.75μm Depth of Focus (±D.F) 1.65μm
Parfocal Distance 95mm Entrance Pupil Diameter 9mm
Field of View (MAX) 2mm Working Wavelength 355-700nm
Mounting Thread M26×0.706 Weight 373g

M Plan Apo 2X

M Plan Apo 2X

Specification Parameter Specification Parameter
Magnification (X) 2X Numerical Aperture (NA) 0.06
Working Distance (WD) 34.7mm Focal Length 100mm
Resolution 5.6μm Depth of Focus (±D.F) 93.2μm
Parfocal Distance 95mm Entrance Pupil Diameter 12mm
Field of View (MAX) 18mm Working Wavelength 380-700nm
Mounting Thread M26×0.706 Weight 208g

M Plan Apo 5X

M Plan Apo 5X

Specification Parameter Specification Parameter
Magnification (X) 5X Numerical Aperture (NA) 0.15
Working Distance (WD) 38.8mm Focal Length 40mm
Resolution 2.2μm Depth of Focus (±D.F) 14.9μm
Parfocal Distance 95mm Entrance Pupil Diameter 12mm
Field of View (MAX) 8mm Working Wavelength 380-700nm
Mounting Thread M26×0.706 Weight 233g

M Plan Apo 10X

M Plan Apo 10X

Specification Parameter Specification Parameter
Magnification (X) 10X Numerical Aperture (NA) 0.28
Working Distance (WD) 32mm Focal Length 20mm
Resolution 1.2μm Depth of Focus (±D.F) 4.3μm
Parfocal Distance 95mm Entrance Pupil Diameter 11.7mm
Field of View (MAX) 4mm Working Wavelength 380-700nm
Mounting Thread M26×0.706 Weight 244g

 M Plan Apo 20X

M Plan Apo 20X

Specification Parameter Specification Parameter
Magnification (X) 20X Numerical Aperture (NA) 0.45
Working Distance (WD) 20mm Focal Length 20mm
Resolution 0.75μm Depth of Focus (±D.F) 1.65μm
Parfocal Distance 95mm Entrance Pupil Diameter 9mm
Field of View (MAX) 2mm Working Wavelength 380-700nm
Mounting Thread M26×0.706 Weight 373g

M Plan Apo 50X

M Plan Apo 50X

Specification Parameter Specification Parameter
Magnification (X) 50X Numerical Aperture (NA) 0.43
Working Distance (WD) 16.3mm Focal Length 4mm
Resolution 0.8μm Depth of Focus (±D.F) 1.8μm
Parfocal Distance 95mm Entrance Pupil Diameter 3.44mm
Field of View (MAX) 0.8mm Working Wavelength 380-700nm
Mounting Thread M26×0.706 Weight 277g

 

Darkfield Microscope Objectives

Designed for observing surface scattering and topography, these objectives feature a plan apochromatic optical configuration, delivering high imaging contrast and large-field observation capability, with a maximum image circle diameter of 40 mm.

M Plan Apo BD

M Plan Apo BD

Specification Parameter Specification Parameter
Magnification (X) 10X Numerical Aperture (NA) 0.28
Working Distance (WD) 24.5mm Focal Length 20mm
Resolution 1.2μm Depth of Focus (±D.F) 4.3μm
Parfocal Distance 95mm Entrance Pupil Diameter 11.7mm
Field of View (MAX) 4mm Working Wavelength 380-700nm
Mounting Thread M26×0.706 Weight 264g

 

White-Light Interference Microscope Objectives

Designed for non-contact measurement of surface topography and geometric features, these objectives feature a plan apochromatic optical configuration with large-field observation capability, supporting an image circle diameter up to 40 mm.

M Plan Apo DI

Specification Parameter Specification Parameter
Magnification (X) 10X Numerical Aperture (NA) 0.28
Working Distance (WD) 13.2mm Focal Length 20mm
Resolution 1.2μm Depth of Focus (±D.F) 4.3μm
Parfocal Distance 95mm Entrance Pupil Diameter 11.7mm
Field of View (MAX) 4mm Working Wavelength 380-700nm
Mounting Thread M26×0.706 Weight 264g

Application Fields

Semiconductor Manufacturing

In this field, Wavelength’s microscope objectives are primarily used for defect analysisfailure localization, and process monitoring.

Application Scenarios:

Defect Inspection and Classification: Identifying and classifying particles, scratches, crystal defects, etc., on wafer surfaces. High resolution and freedom from color artifacts ensure accurate defect feature recognition.

Failure Analysis: Locating short-circuit and open-circuit points in faulty chips. The planarity ensures that both edges and center remain equally sharp when searching for anomalous areas across a large field of view.

Critical Dimension Measurement: Performing sub-micron precision measurements of line widths, via diameters, etc., on integrated circuits. Superior image quality is the foundation for measurement accuracy.

Internal Inspection via Infrared Objectives: Dedicated plan apochromatic infrared objectives enable non-destructive internal inspection of packaged chips, as silicon material is transparent to infrared light.

Semiconductor Manufacturing

Industrial Inspection

In the industrial sector, Wavelength’s microscope objectives are used for material analysisquality control, and non-destructive testing.

Application Scenarios:

Materials Science: Analyzing grain structure, phase composition, and defects in metals, ceramics, and polymers. Apochromatic correction is essential for observing anisotropic materials under polarized light.

Precision Manufacturing: Inspecting wear, micro-cracks, and surface roughness on precision components (e.g., cutting tools, bearings). High resolution enables early detection of potential failure signs.

Electronics Industry: Checking solder joint quality and circuit integrity on PCBs. Planar objectives facilitate automated scanning and measurement across entire circuit boards.

 


Post time: Jul-30-2026