China Differential Interference Contrast (DIC) Microscope Lens Manufacture and Factory

Differential Interference Contrast (DIC) Microscope Lens

The working principle of Differential Interference Contrast (DIC) microscopy leverages the phenomenon of coherent light interference to convert variations in sample surface topography into optical path differences. By utilizing position-sensitive detectors to measure the intensity variations of the light wavefront, the system derives precise height changes across the sample surface through digital signal processing.

DIC microscopy is widely applied in biological microscopy, semiconductor chip surface inspection, nanomaterial preparation and modification, surface quality testing of precision components, PCB defect inspection, and precision mold testing. It stands as an indispensable tool in modern scientific research and advanced industrial inspection.

Magnification：10X

Numerical Aperture (NA)：0.3

Focal length：20.0 mm

Wavelength：450 nm

Cover Glass Thickness：0 mm

AR Coating Reflectance：Ravg ＜ 1% (400 – 700 nm)

Resolution：1.12 μm

Line Pairs：440 lp/mm

Parfocal Distance：45 mm

Objective Threading：4/5”-1/36”

Working Distance：11.0 mm

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Product Advantages

This system offers high-resolution, high-precision, non-contact, and non-destructive measurement. With resolution reaching the sub-nanometer level, it enables the observation of finer surface structures and topographical changes. Because the technique requires no physical contact with the sample, it eliminates the risk of sample damage and contamination, making it highly suitable for observing and researching biological and medical samples.

The microscope features a compact, stable, and highly rigid main body that meets the vibration isolation requirements for microscopic operations. Its modular design concept facilitates convenient system upgrades. The guide-pillar lifting mechanism allows for quick adjustment of the distance between the stage and the objective lens, making it suitable for inspecting workpieces of varying thicknesses.

Equipped with a mechanical moving stage, it ensures effective positioning of workpieces and is ideal for microscopic observation or rapid inspection of multiple samples. The ergonomic design provides more convenient and comfortable operation with a more spacious working area.

This example demonstrates the exceptional capability of DIC microscopy in semiconductor manufacturing. By converting subtle topographic variations into high-contrast relief images, the DIC system clearly reveals micro-scratches, surface residues, and sub-micron particle contamination on silicon wafers. This non-destructive inspection method is critical for enhancing wafer yield and quality control.

Parameter table:

Magnification	10X
Working Distance (WD)	32 mm
Resolution	1.2 um
Parfocal Distance	95 mm
Max Field of View	4 mm
Thread	M26X0.706
Numerical Aperture (NA)	0.28
Focal Length	20 mm
Depth of Field (D.F)	4.3 um
Entrance Pupil Diameter	11.7 mm
Working Wavelength	380-700 nm
Weight	244 g

Magnification	7X
Working Distance (WD)	37 mm
Resolution	1.6 um
Parfocal Distance	95 mm
Line Pairs	625 lp/mm
Objective Threading	M26X0.706
Numerical Aperture (NA)	0.22
Focal Length	28.6 mm
Cover Glass Thickness	None
Transmittance	87%
Working Wavelength	400-700 nm

Application of DIC microscope：

1.Biological Imaging: Enables non-invasive, dye-free observation of live cells. Combines with fluorescence for tracking cell dynamics and provides pseudo-3D views for structural analysis of tissues and microorganisms.
2.Semiconductor Inspection: Detects microscale defects and residues on wafers and PCBs. Offers non-contact surface uniformity measurement and real-time process monitoring to improve manufacturing yield.
3.Materials & Nanotechnology: Characterizes surface topography (roughness, phase separation) of metals and polymers. Monitors pattern fidelity in nanofabrication processes.
4.Precision Engineering: Inspects precision components for scratches and pits. Aids in dimensional analysis of MEMS and provides high-resolution PCB defect inspection (solder joints, vias, cracks).