Differential Interference Contrast (DIC) Microscopes

1.Working Principle of Differential Interference Contrast (DIC) Microscopy

Differential Interference Contrast (DIC) microscopy works on the principle of coherent light interference, converting variations in sample surface topography into optical path differences. A position-sensitive detector measures intensity changes in the light wavefront, and digital signal processing derives the height variation of the sample surface. By adjusting the relative phase difference, the technique can also measure multiple optical path differences, yielding more detailed surface topography information. DIC microscopes are widely used in biological microscopy, semiconductor chip surface inspection, preparation and modification of nanomaterials, surface quality inspection of precision parts, PCB defect detection, and precision mold inspection, making them an important tool in modern scientific research.

Industrial Microscope Camera Adapter & Imaging Module | Edinburgh OE

Modular DIC Microscope Assembly: Components & Configuration

2.Advantages of Differential Interference Contrast (DIC) Microscopy

Their advantages include high resolution, high precision, non-contact, and non-destructive measurement. Compared with conventional microscopes, DIC microscopes can achieve sub-nanometer resolution, enabling observation of finer surface structures and topographic changes. In addition, since the technique requires no contact with the sample, it eliminates sample damage and contamination, making it highly suitable for observing and studying biological and medical samples.

The DIC microscope developed by Wavelength Opto-Electronic features a compact, stable, high-rigidity body that meets the vibration isolation requirements of microscopic operations. Its modular functional design facilitates system upgrades. The guide-pillar lifting mechanism enables rapid adjustment of the distance between the stage and the objective, making it suitable for inspecting workpieces of varying thicknesses. Equipped with a mechanical moving stage, it effectively positions workpieces and is suitable for microscopic observation or rapid inspection of multiple samples. Its ergonomic design provides more convenient and comfortable operation with greater workspace.

High-Resolution DIC Inspection of Conductive Particles & Circuit Patterns

DIC Microscopy for Microelectronics: Surface Defect & Particle Detection

Conductive Particle Inspection on PCBs

3.Product Specifications

Magnification 10X
Working Distance (WD) 32 mm
Resolution 1.2 um
Parfocal Distance 95 mm
Max Field of View 4 mm
Thread M26X0.706
Numerical Aperture (NA) 0.28
Focal Length 20 mm
Depth of Field (D.F) 4.3 um
Entrance Pupil Diameter 11.7 mm
Working Wavelength 380-700 nm
Weight 244 g

 

Magnification 7X
Working Distance (WD) 37 mm
Resolution 1.6 um
Parfocal Distance 95 mm
Line Pairs 625 lp/mm
Objective Threading M26X0.706
Numerical Aperture (NA) 0.22
Focal Length 28.6 mm
Cover Glass Thickness None
Transmittance 87%
Working Wavelength 400-700 nm

4.Applications of DIC Microscopy

1.Differential interference contrast (DIC) microscopy is widely used in biological imaging because it enables non-invasive observation of living cells without staining. It supports real-time visualization of cell interactions and protein dynamics when combined with fluorescence microscopy, and its pseudo-3D relief effect improves structural interpretation of tissues, organoids, and microorganisms.

2.In the semiconductor industry, DIC microscopy is used for precision inspection and process control. It helps detect microscale particles, residues, and etching defects on circuit boards and wafers, supports non-contact surface uniformity measurement, and enables process monitoring that reduces defect rates and improves manufacturing yield.

3.In materials science and nanotechnology, DIC microscopy supports nanoscale surface characterization, microstructure analysis, and nanofabrication process monitoring. It helps analyze height, roughness, and phase separation in metals, polymers, ceramics, and composite materials.

4.In precision engineering and manufacturing, DIC microscopy aids quality control of micromachined and electronic components. It is used for surface quality inspection, dimensional analysis of MEMS and optical parts, and high-resolution PCB defect inspection for solder joints, vias, and cracks.

 DIC Microscopy Optical Path: Working Principle Diagram


Post time: Oct-06-2026